BGA IC Reballing Stencil For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max
BGA IC REBALLING STENCIL – IP 13/13 MINI/13 PRO/13 PRO MAX
| Weight | 0.3 kg |
|---|---|
| Dimensions | 1 × 1 × 1 cm |
| Manufacturer | CHINA |
| Model | BGA IC Reballing Stencil/IP13/13Pro/13Max/13Mini |
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