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BEST – IC Chip Reballing Stencil Kit
BEST – IC CHIP REBALLING STENCIL KIT – SOLDER TEMPLATE – IP6 TO 12 MAX
| Weight | 0.3 kg |
|---|---|
| Dimensions | 1 × 1 × 1 cm |
| Manufacturer | BEST |
| Model | BGA IC Reballing Stencil Kit |
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